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研究解説 : 3-D Microsystem Packaging for Interconnecting Electrical, Optical and Mechanical Microdevices to The Eexternal World.
http://hdl.handle.net/2261/00074697
http://hdl.handle.net/2261/00074697f59dc6de-53f3-4847-a602-040be6a4b7fd
名前 / ファイル | ライセンス | アクション |
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sk053002006.pdf (695.2 kB)
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Item type | 紀要論文 / Departmental Bulletin Paper(1) | |||||
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公開日 | 2018-06-12 | |||||
タイトル | ||||||
タイトル | 研究解説 : 3-D Microsystem Packaging for Interconnecting Electrical, Optical and Mechanical Microdevices to The Eexternal World. | |||||
言語 | ||||||
言語 | eng | |||||
資源タイプ | ||||||
資源 | http://purl.org/coar/resource_type/c_6501 | |||||
タイプ | departmental bulletin paper | |||||
著者 |
GOUY, Jean-Philippe
× GOUY, Jean-Philippe× TIXIER, Agnès× MITA, Yoshio× OSHIMA, Satoshi× FUJITA, Hiroyuki |
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著者所属 | ||||||
著者所属 | LIMMS/CNRS-IIS, University of Tokyo | |||||
著者所属 | ||||||
著者所属 | VDEC, University of Tokyo | |||||
著者所属 | ||||||
著者所属 | Institute of Industrial Science, University of Tokyo | |||||
著者所属 | ||||||
著者所属 | Center for International Research on MicroMechatronics/IIS, University of Tokyo | |||||
内容記述 | ||||||
内容記述タイプ | Other | |||||
内容記述 | マイクロマシン特集号 | |||||
書誌情報 |
生産研究 巻 53, 号 2, p. 108-111, 発行日 2001-02 |
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ISSN | ||||||
収録物識別子タイプ | ISSN | |||||
収録物識別子 | 18812058 | |||||
ISSN | ||||||
収録物識別子タイプ | ISSN | |||||
収録物識別子 | 0037105X | |||||
書誌レコードID | ||||||
収録物識別子タイプ | NCID | |||||
収録物識別子 | AN00127075 | |||||
DOI | ||||||
識別子タイプ | DOI | |||||
関連識別子 | info:doi/10.11188/seisankenkyu.53.108 | |||||
出版者 | ||||||
出版者 | 東京大学生産技術研究所 | |||||
出版者別名 | ||||||
Institute of Industrial Science, the University of Tokyo |