{"created":"2021-03-01T06:35:36.239560+00:00","id":18224,"links":{},"metadata":{"_buckets":{"deposit":"24a2ef84-4d54-40a6-bb22-ed9bda8f27cf"},"_deposit":{"id":"18224","owners":[],"pid":{"revision_id":0,"type":"depid","value":"18224"},"status":"published"},"_oai":{"id":"oai:repository.dl.itc.u-tokyo.ac.jp:00018224","sets":["171:1108:1192:1200","9:504:1111:1194:1201"]},"item_4_alternative_title_1":{"attribute_name":"その他のタイトル","attribute_value_mlt":[{"subitem_alternative_title":"Trend of Experimental Analyses in IC Packaging Process"}]},"item_4_biblio_info_7":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"1997-09","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"9","bibliographicPageEnd":"413","bibliographicPageStart":"406","bibliographicVolumeNumber":"49","bibliographic_titles":[{"bibliographic_title":"生産研究"}]}]},"item_4_description_5":{"attribute_name":"抄録","attribute_value_mlt":[{"subitem_description":"半導体の多くは, 熱硬化性樹脂を用いてトランスファ成形によってパッケージングが行われる. 近年の半導体素子の高機能化, 実装の高密度化は, 入出力ピン数の増大や狭ピッチ化, そしてパッケージの薄肉化を促している. そのために, 様々な不良現象が従来よりも起こりやすい状況にあり, 現場レベルのみでの不良対策が一層困難になってきたことから, 系統的な研究に基づく不良現象対策が強く望まれている. 本稿では, 熱硬化性樹脂を用いた半導体パッケージング技術における樹脂流動および不良現象について, 最新の実験解析の動向を解説する.","subitem_description_type":"Abstract"}]},"item_4_description_6":{"attribute_name":"内容記述","attribute_value_mlt":[{"subitem_description":"特集 先進プロダクションテクノロジー","subitem_description_type":"Other"}]},"item_4_full_name_3":{"attribute_name":"著者別名","attribute_value_mlt":[{"nameIdentifiers":[{"nameIdentifier":"30690","nameIdentifierScheme":"WEKO"}],"names":[{"name":"Sato, Masahiro"}]},{"nameIdentifiers":[{"nameIdentifier":"30691","nameIdentifierScheme":"WEKO"}],"names":[{"name":"Yokoi, Hidetoshi"}]}]},"item_4_publisher_20":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"東京大学生産技術研究所"}]},"item_4_source_id_10":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AN00127075","subitem_source_identifier_type":"NCID"}]},"item_4_source_id_8":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"0037105X","subitem_source_identifier_type":"ISSN"}]},"item_4_subject_15":{"attribute_name":"日本十進分類法","attribute_value_mlt":[{"subitem_subject":"549","subitem_subject_scheme":"NDC"}]},"item_4_text_21":{"attribute_name":"出版者別名","attribute_value_mlt":[{"subitem_text_value":"Institute of Industrial Science, the University of Tokyo"}]},"item_4_text_4":{"attribute_name":"著者所属","attribute_value_mlt":[{"subitem_text_value":"東京大学生産技術研究所第2部 プラスチック加工学"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"佐藤, 正博"}],"nameIdentifiers":[{"nameIdentifier":"30688","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"横井, 秀俊"}],"nameIdentifiers":[{"nameIdentifier":"30689","nameIdentifierScheme":"WEKO"}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2017-06-08"}],"displaytype":"detail","filename":"sk049009006.pdf","filesize":[{"value":"1.5 MB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"sk049009006.pdf","url":"https://repository.dl.itc.u-tokyo.ac.jp/record/18224/files/sk049009006.pdf"},"version_id":"5c633b8e-cc72-4cd9-856a-e03247d66cce"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"jpn"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"departmental bulletin paper","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"特集6 : 研究解説 : 半導体パッケージング過程の実験解析動向","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"特集6 : 研究解説 : 半導体パッケージング過程の実験解析動向"}]},"item_type_id":"4","owner":"1","path":["1200","1201"],"pubdate":{"attribute_name":"公開日","attribute_value":"2013-02-13"},"publish_date":"2013-02-13","publish_status":"0","recid":"18224","relation_version_is_last":true,"title":["特集6 : 研究解説 : 半導体パッケージング過程の実験解析動向"],"weko_creator_id":"1","weko_shared_id":null},"updated":"2022-12-19T05:07:34.233542+00:00"}