{"created":"2021-03-01T07:10:29.280324+00:00","id":49576,"links":{},"metadata":{"_buckets":{"deposit":"48132be0-9988-4981-aa21-eec12267169b"},"_deposit":{"id":"49576","owners":[],"pid":{"revision_id":0,"type":"depid","value":"49576"},"status":"published"},"_oai":{"id":"oai:repository.dl.itc.u-tokyo.ac.jp:00049576","sets":["171:1108:1109:7813","9:504:1111:1112:7814"]},"item_4_biblio_info_7":{"attribute_name":"書誌情報","attribute_value_mlt":[{"bibliographicIssueDates":{"bibliographicIssueDate":"2001-02","bibliographicIssueDateType":"Issued"},"bibliographicIssueNumber":"2","bibliographicPageEnd":"111","bibliographicPageStart":"108","bibliographicVolumeNumber":"53","bibliographic_titles":[{"bibliographic_title":"生産研究"}]}]},"item_4_description_6":{"attribute_name":"内容記述","attribute_value_mlt":[{"subitem_description":"マイクロマシン特集号","subitem_description_type":"Other"}]},"item_4_publisher_20":{"attribute_name":"出版者","attribute_value_mlt":[{"subitem_publisher":"東京大学生産技術研究所 "}]},"item_4_relation_11":{"attribute_name":"DOI","attribute_value_mlt":[{"subitem_relation_type_id":{"subitem_relation_type_id_text":"info:doi/10.11188/seisankenkyu.53.108","subitem_relation_type_select":"DOI"}}]},"item_4_source_id_10":{"attribute_name":"書誌レコードID","attribute_value_mlt":[{"subitem_source_identifier":"AN00127075 ","subitem_source_identifier_type":"NCID"}]},"item_4_source_id_8":{"attribute_name":"ISSN","attribute_value_mlt":[{"subitem_source_identifier":"18812058","subitem_source_identifier_type":"ISSN"},{"subitem_source_identifier":"0037105X ","subitem_source_identifier_type":"ISSN"}]},"item_4_text_21":{"attribute_name":"出版者別名","attribute_value_mlt":[{"subitem_text_value":"Institute of Industrial Science, the University of Tokyo"}]},"item_4_text_4":{"attribute_name":"著者所属","attribute_value_mlt":[{"subitem_text_value":"LIMMS/CNRS-IIS, University of Tokyo"},{"subitem_text_value":"VDEC, University of Tokyo"},{"subitem_text_value":"Institute of Industrial Science, University of Tokyo"},{"subitem_text_value":"Center for International Research on MicroMechatronics/IIS, University of Tokyo"}]},"item_creator":{"attribute_name":"著者","attribute_type":"creator","attribute_value_mlt":[{"creatorNames":[{"creatorName":"GOUY, Jean-Philippe"}],"nameIdentifiers":[{"nameIdentifier":"146881","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"TIXIER, Agnès"}],"nameIdentifiers":[{"nameIdentifier":"146882","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"MITA, Yoshio"}],"nameIdentifiers":[{"nameIdentifier":"146883","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"OSHIMA, Satoshi"}],"nameIdentifiers":[{"nameIdentifier":"146884","nameIdentifierScheme":"WEKO"}]},{"creatorNames":[{"creatorName":"FUJITA, Hiroyuki"}],"nameIdentifiers":[{"nameIdentifier":"146885","nameIdentifierScheme":"WEKO"}]}]},"item_files":{"attribute_name":"ファイル情報","attribute_type":"file","attribute_value_mlt":[{"accessrole":"open_date","date":[{"dateType":"Available","dateValue":"2018-06-12"}],"displaytype":"detail","filename":"sk053002006.pdf","filesize":[{"value":"695.2 kB"}],"format":"application/pdf","licensetype":"license_note","mimetype":"application/pdf","url":{"label":"sk053002006.pdf","url":"https://repository.dl.itc.u-tokyo.ac.jp/record/49576/files/sk053002006.pdf"},"version_id":"a798318c-3f49-4275-9dea-61036716cb84"}]},"item_language":{"attribute_name":"言語","attribute_value_mlt":[{"subitem_language":"eng"}]},"item_resource_type":{"attribute_name":"資源タイプ","attribute_value_mlt":[{"resourcetype":"departmental bulletin paper","resourceuri":"http://purl.org/coar/resource_type/c_6501"}]},"item_title":"研究解説 : 3-D Microsystem Packaging for Interconnecting Electrical, Optical and Mechanical Microdevices to The Eexternal World.","item_titles":{"attribute_name":"タイトル","attribute_value_mlt":[{"subitem_title":"研究解説 : 3-D Microsystem Packaging for Interconnecting Electrical, Optical and Mechanical Microdevices to The Eexternal World."}]},"item_type_id":"4","owner":"1","path":["7813","7814"],"pubdate":{"attribute_name":"公開日","attribute_value":"2018-06-12"},"publish_date":"2018-06-12","publish_status":"0","recid":"49576","relation_version_is_last":true,"title":["研究解説 : 3-D Microsystem Packaging for Interconnecting Electrical, Optical and Mechanical Microdevices to The Eexternal World."],"weko_creator_id":"1","weko_shared_id":null},"updated":"2022-12-19T04:24:21.598393+00:00"}